Xiaomi has officially announced New XRING for thier upcoming devices which will be launched with HyperOS 4 in September 2026. Everyone is excited for this new SoC, as last one was launched at this time too. But this year they announced more chips with XRING O3. XRING D100 and XRING O100 are also confirmed for September 2026, official launch will be done soon.
Xiaomi XRING O3 And More
Xiaomi New XRING are based on AI which is for People, Cars and Homes. Some specifications are also confirmed as they revealed posters of new SoC, check below to see them and whenver more details will arrive you will see detailed article regarding that.
XRING O100
- 1.22TB/s high-bandwidth AI acceleration chip
- Advanced Packaging 6nm 3D Wafer-Level Stacking
- Wafer on Wafer advanced packaging, high-speed AI-dedicated memory
- Hybrid Bonding Technology
- With a bond spacing of only 1.4µm, there are 2.58 million physical pathways.
- Xuanjie high-bandwidth matrix bus, 14-core NPU for efficient parallel computing
- With 16 times the bandwidth of flagship mobile phones, the edge inference speed reaches 330 TPS.
XRING D100
- Intelligent driving high-performance AI chip
- China’s first 3mm intelligent driving chip
- 20-core high-performance CPU, 16-core high-performance NPU
- Supports up to 200B edge models running locally.
- Supports up to 160GB of unified memory
- Xuanjie high-speed interconnection bus
- Support multi-chip fusion computing
XRING O3
Xiaomi’s XRING 03 is shaping up to be an absolute flagship SoC monster. According to the claimed AnTuTu V11 results, the chip scores a massive 5.22 million points in Xiaomi Lab’s low-temperature environment. Built on a 3nm process, XRING 03 features a 133mm² chip area and 24 billion transistors. Its 10-core all-big-core CPU includes 6 super cores + 4 large cores, reaching up to 4.35GHz, with claimed scores of 3945 single-core and 15,221 multi-core.
The GPU is equally impressive, featuring the first 16-core G2-Ultra NX, with up to 85% higher peak performance, 182% better ray tracing, and up to 64% lower power consumption. For AI, XRING 03 packs a quad-core NPU delivering 200 TOPS tensor computing power, while also supporting Xiaomi’s edge-side AI models. And that’s not all — it is claimed to be the first chip to support LPDDR6, offering 10,667Mbps memory speed and 113.8GB/s bandwidth, a huge 48% improvement over LPDDR5X.
Xiaomi 18 Fold And Xiaomi Pad 9 Pro Max
Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max are confirmed to launch with XRING O3 in September 2026. These are the upcoming devices which are set to launch at anytime as they started preparing stable versions of HyperOS 4 for Xiaomi Pad 9 Series, so we can see the official event soon.
Conclusion
If you have any query related to these SoC, then comment now and share your thoughts, both devices will be launched in China region only, no Global variant for both.
